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Created February 15, 2020 21:51
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IEDM 2019
CMOS
First Demonstration of CMOS Inverter and 6T-SRAM Based on GAA CFETs Structure for 3D-IC Applications
Taiwan Semiconductor Research Institute,Hsinchu,Taiwan
National Cheng Kung University,Dept. of Electrical Engineering,Tainan,Taiwan
National Chiao Tung University,Dept. of Electrophysics,Hsinchu,Taiwan
National Sun Yat-sen University,Dept. of Electrical Engineering,Kaohsiung,Taiwan
Feng Chia University,Dept. of Electronic Engineering,Taichung,Taiwan
Mechanical and Systems Research Laboratories, Industrial Technology Research Institute,Hsinchu,Taiwan
Institute of Fluid Science, Tohoku University,Sendai,Japan
https://ieeexplore.ieee.org/document/8993525
5nm CMOS Production Technology Platform featuring full-fledged EUV, and High Mobility Channel FinFETs with densest 0.021µm2 SRAM cells for Mobile SoC and High Performance Computing Applications
Taiwan Semiconductor Manufacturing Company,Hsinchu, Taiwan,R.O.C
https://ieeexplore.ieee.org/document/8993577
Vertical Nanowire and Nanosheet FETs: Device Features, Novel Schemes for Improved Process Control and Enhanced Mobility, Potential for Faster & More Energy Efficient Circuits
Imec,Leuven,Belgium,3001
https://ieeexplore.ieee.org/document/8993602
Enabling Sub-5nm CMOS Technology Scaling Thinner and Taller!
imec,Leuven,Belgium
https://ieeexplore.ieee.org/document/8993631
Novel forksheet device architecture as ultimate logic scaling device towards 2nm
imec,Leuven,Belgium
https://ieeexplore.ieee.org/document/8993635
State-of-the-art TCAD: 25 years ago and today
Intel Corporation,Logic Technology Division,Hillsboro,OR,USA
https://ieeexplore.ieee.org/document/8993451
Machine Learning-enhanced Multi-dimensional Co-Optimization of Sub-10nm Technology Node Options
Intel Corporation,Hillsboro,OR,USA
https://ieeexplore.ieee.org/document/8993557
Imaging, Modeling and Engineering of Strain in Gate-All-Around Nanosheet Transitors
Minatec campus, and Univ. Grenoble Alpes,CEA-LETI,Grenoble,France,38054
IBM Research,Albany,NY,12203
https://ieeexplore.ieee.org/document/8993524
Memory
A Novel Double-Density Hemi-Cylindrical (HC) Structure to Produce More than Double Memory Density Enhancement for 3D NAND Flash
Macronix International Co., Ltd,Emerging Central Lab.,Hsinchu,Taiwan
https://ieeexplore.ieee.org/document/8993461
3D Semicircular Flash Memory Cell: Novel Split-Gate Technology to Boost Bit Density
Kioxia Corporation,Yokkaichi,Japan
https://ieeexplore.ieee.org/document/8993673
Photonics
High-performance hybrid silicon and lithium niobate Mach–Zehnder modulators for over 100 Gbit/s
Sun Yat-sen University,State Key Laboratory of Optoelectronic Materials and Technologies and School of Physics and Engineering,Guangzhou,China,510275
https://ieeexplore.ieee.org/document/8993510
A Silicon Photonics Technology for 400 Gbit/s Applications
STMicroelectronics,Crolles,France
https://ieeexplore.ieee.org/document/8993627
Machine learning
Design Considerations for Efficient Deep Neural Networks on Processing-in-Memory Accelerators
Massachusetts Institute of Technology,Cambridge,USA
https://ieeexplore.ieee.org/document/8993662
Optimal Design Methods to Transform 3D NAND Flash into a High-Density, High-Bandwidth and Low-Power Nonvolatile Computing in Memory (nvCIM) Accelerator for Deep-Learning Neural Networks (DNN)
Macronix International Co., Ltd,Hsinchu,Taiwan
https://ieeexplore.ieee.org/document/8993652
Quantum
A Probabilistic Approach to Quantum Inspired Algorithms
Purdue University,School of Electrical and Computer Engineering,IN,USA,47907
https://ieeexplore.ieee.org/document/8993655
Device engineering for diamond quantum sensors
Tokyo Institute of Technology,Meguro, Tokyo,Japan
https://ieeexplore.ieee.org/document/8993656
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